FPC Production Capability

Process

Item

Critical

Common

Drilling hole

Min. drill hole diameter°]mm°^

0.20

°ō0.25

Hole to hole position (mm)

°”0.03

+/-0.05

Max. working area (mm)

690*269

PTH

Whole board copper plating thickness°]mil°^

0.2

0.6°„1.0

Pattern copper plating thickness°]mil°^

0.3

0.4-0.6

Min. plating hole thickness°]mil°^

0.5

0.8

Average plating hole thickness°]mil°^

1.0

0.9

PTH

Hole diameter°]mm°^

°”0.03

°”0.05

NPTH

Hole diameter°]mm°^

°”0.03

°”0.05

Max. Pattern plating thickness for through hole°]mm°^

3.0

2.0

Micro etch

Micro etching Qty.

15~30u"

Tolerance undefined

DES

Circuit°GLW/LD(mil)

Cu thickness°G1/3OZ

2/2

3/3

Cu thickness°G1/2OZ

2.5/2.5

3/3

Cu thickness°G1OZ

3/3

3/3

Cu thickness°G2OZ

4/4

6/6

LW/LD tolerance of finished FPC

°”20%

°”30%

Min. distance between circuit with board edge°]mil°^

6

8

Layers

FPC with Stiffener

4

4

Air gap board

4

4

CVL

CVL lamination tolerance (mm)

0.2

0.4

Min distance between cover lay opening to circuit(mm°^

0.15

0.2

Adhesive excess amount (mm)

0.1

0.2

One-side Cover lay lamination thickness tolerance°]um°^

°”2.5

°”6.0

Layer-layer position tolerance °]mm°^

0.1

0.2

Lamination

Max. working area

490*490mm

One-side Coverlay lamination thickness tolerance°]um°^

°”2.5

°”6.0

Cutting

FR4 cutting thickness°]mm°^

1.0

°ō0.3

PANEL Size°]mm°^

500°—400

250°—300

Coverlay opening precision°]mm°^

°”0.03

°”0.05

Min distance between two coverlay opening°]mm°^

Tooling

0.4

°Š0.6

Drilling

0.4

0.6

Silkscreen printing

Min line width

0.1mm

Character height

1.0mm

Tolerance control

°”0.2mm

ENIG°]uinch°^

Ni thickness

80°„300

80°„160

Gold thickness

1°„10

1°„5

Gold plating        °]uinch°^

Ni thickness

80°„340

120°„240

Gold thickness

1°„50

1°„5

Immersion Tin

Tin thickness°]um°^

0.5

0.5°„1.0

Outline Punching

Die-cut tool punching tolerance°]mm°^

°”0.2

°”0.3

Steel-tool punching tolerance°]mm°^

°”0.05

°”0.10

ZIF Outline tolerance °]mm°^

°”0.05

°”0.10

 

 

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